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IEC 62137-1-3:2008 ED1

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
27. 11. 2008.

Опште информације

60.60     27. 11. 2008.

IEC

TC 91

Međunarodni standard

31.190  

engleski   francuski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

The test method described in IEC 62137-1-3:2008 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 62137-1-3:2008 ED1
60.60 Standard objavljen
27. 11. 2008.