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IEC 60068-2-83:2011 ED1

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
7. 9. 2011.

Опште информације

99.60     27. 5. 2025.

IEC

TC 91

Međunarodni standard

19.040     31.190  

engleski   francuski  

Kupovina

Revidiran

Jezik na kome želite da primite dokument.

Apstrakt

IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes.
NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.

Životni ciklus

TRENUTNO

POVUČEN
IEC 60068-2-83:2011 ED1
99.60 Povlačenje stupilo na snagu
27. 5. 2025.

REVIDIRAN OD

OBJAVLJEN
IEC 60068-2-83:2025 ED2