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Glavni meni

IEC TR 60068-3-12:2007 ED1

Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
12. 3. 2007.

Опште информације

99.60     17. 10. 2014.

IEC

TC 91

Tehnički izveštaj

19.040  

engleski  

Kupovina

Revidiran

Jezik na kome želite da primite dokument.

Apstrakt

Presents two approaches to establish a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. The presented process window covers a great variety of electronic products, including a large range of package sizes (molded active electronic components, passive components and electromechanical components)

Životni ciklus

TRENUTNO

POVUČEN
IEC TR 60068-3-12:2007 ED1
99.60 Povlačenje stupilo na snagu
17. 10. 2014.

REVIDIRAN OD

POVUČEN
IEC TR 60068-3-12:2014 ED2