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IEC 60191-5:1987 ED1

Mechanical standardization of semiconductor devices. Part 5: Recommendations applying to tape automated bonding (TAB) of integrated circuits.
15. 9. 1987.

Опште информације

99.60     23. 4. 1997.

IEC

TC 47/SC 47D

Međunarodni standard

31.080.01  

engleski   francuski   ruski  

Kupovina

Revidiran

Jezik na kome želite da primite dokument.

Apstrakt

Gives recommendations applying to tape automated bonding (TAB) of integrated circuits. Dimension values or requirements given in this standard for tape width, perforations, test pattern, outer lead bonding (OLB), etc., correspond to the state of the market at the date of edition of this standard. More especially, tape width and perforation dimensions have been derived from motion picture film standards.
Progress in integrated circuit (IC) technology resulting in a higher number of terminals and user requirements may lead in the future to additional or new dimensions.

Životni ciklus

TRENUTNO

POVUČEN
IEC 60191-5:1987 ED1
99.60 Povlačenje stupilo na snagu
23. 4. 1997.

REVIDIRAN OD

OBJAVLJEN
IEC 60191-5:1997 ED2