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IEC 60191-5:1997 ED2

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
23. 4. 1997.

Опште информације

60.60     23. 4. 1997.

IEC

TC 47/SC 47D

Međunarodni standard

31.080.01  

engleski   francuski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.

Životni ciklus

PRETHODNO

POVUČEN
IEC 60191-5:1987 ED1

TRENUTNO

OBJAVLJEN
IEC 60191-5:1997 ED2
60.60 Standard objavljen
23. 4. 1997.