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Glavni meni

IEC PAS 62137-3:2008 ED1

Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
13. 11. 2008.

Опште информације

99.60     8. 11. 2011.

IEC

TC 91

Javno dostupna specifikacija

31.190  

engleski  

Kupovina

Zamenjen

Jezik na kome želite da primite dokument.

Apstrakt

IEC/PAS 62137-3:2008(E) describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices, including various types of solder material.

Životni ciklus

TRENUTNO

POVUČEN
IEC PAS 62137-3:2008 ED1
99.60 Povlačenje stupilo na snagu
8. 11. 2011.

REVIDIRAN OD

OBJAVLJEN
IEC 62137-3:2011 ED1