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IEC 62047-13:2012 ED1

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
28. 2. 2012.

Опште информације

60.60     28. 2. 2012.

IEC

TC 47/SC 47F

Međunarodni standard

31.080.99  

engleski   francuski  

Kupovina

Objavljen

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Apstrakt

IEC 62047-13:2012 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive strength measurement of microstructures, prepared on a substrate, with width and thickness of 1 μm to 1 mm, respectively. This standard specifies the adhesive testing method for micro-sized-elements in order to optimally select materials and processing conditions for MEMS devices. This standard does not particularly restrict test piece material, test piece size and performance of the measuring device, since the materials and size of MEMS device components range widely and testing machine for micro-sized materials has not been generalized.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 62047-13:2012 ED1
60.60 Standard objavljen
28. 2. 2012.