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IEC 61191-3:2017 ED2

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
30. 5. 2017.

Опште информације

60.60     30. 5. 2017.

IEC

TC 91

Međunarodni standard

31.240  

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Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.

Životni ciklus

PRETHODNO

POVUČEN
IEC 61191-3:1998 ED1

TRENUTNO

OBJAVLJEN
IEC 61191-3:2017 ED2
60.60 Standard objavljen
30. 5. 2017.