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IEC 63011-2:2018 ED1

Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect
28. 11. 2018.

Опште информације

60.60     28. 11. 2018.

IEC

TC 47/SC 47A

Međunarodni standard

31.200  

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Apstrakt

IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 63011-2:2018 ED1
60.60 Standard objavljen
28. 11. 2018.