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IEC 62878-1:2019 ED1

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
14. 10. 2019.

Опште информације

60.60     14. 10. 2019.

IEC

TC 91

Međunarodni standard

31.180     31.190  

engleski   francuski  

Kupovina

Objavljen

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Apstrakt

IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 62878-1:2019 ED1
60.60 Standard objavljen
14. 10. 2019.

Nacionalna preuzimanja

SRPS EN IEC 62878-1:2020  
ISS

Tehnologija montaže integrisanih komponenata – Deo 1: Opšta specifikacija za komponente integrisane u supstrate

60.60   Standard objavljen

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