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IEC 62878-2-5:2019 ED1

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
16. 9. 2019.

Опште информације

60.60     16. 9. 2019.

IEC

TC 91

Međunarodni standard

31.180     31.190  

engleski   francuski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

IEC 62878-2-5:2019 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.
This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers.
IEC 62878-2-5:2019 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.

Životni ciklus

PRETHODNO

POVUČEN
IEC PAS 62878-2-5:2015 ED1

TRENUTNO

OBJAVLJEN
IEC 62878-2-5:2019 ED1
60.60 Standard objavljen
16. 9. 2019.

Nacionalna preuzimanja

SRPS EN IEC 62878-2-5:2020  
ISS

Tehnologija montaže integrisanih komponenata – Deo 2-5: Implementacija 3D formata podataka za supstrat sa integrisanim komponentama

60.60   Standard objavljen

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