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IEC 61188-5-6:2003 ED1

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
23. 1. 2003.

Опште информације

60.60     23. 1. 2003.

IEC

TC 91

Međunarodni standard

31.190  

engleski   francuski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 61188-5-6:2003 ED1
60.60 Standard objavljen
23. 1. 2003.

REVIDIRAN OD

OBJAVLJEN
IEC 61188-6-2:2021 ED1

OBJAVLJEN
IEC 61188-6-3:2024 ED1