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Glavni meni

IEC 61190-1-3:2002 ED1

Attachment materials for electronic assembly - Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
22. 3. 2002.

Опште информације

99.60     26. 4. 2007.

IEC

TC 91

Međunarodni standard

31.190  

engleski   francuski  

Kupovina

Revidiran

Jezik na kome želite da primite dokument.

Apstrakt

Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications as well as for special electronic grade solders. This standard is a quality control document (not intended to relate directly to the material performance in the manufacturing process).

Životni ciklus

TRENUTNO

POVUČEN
IEC 61190-1-3:2002 ED1
99.60 Povlačenje stupilo na snagu
26. 4. 2007.

REVIDIRAN OD

POVUČEN
IEC 61190-1-3:2007 ED2