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IEC 61190-1-3:2007 ED2

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
10. 11. 2010.

Опште информације

99.60     13. 12. 2017.

WPUB   

IEC

TC 91

Međunarodni standard

31.190  

engleski   francuski  

Kupovina

Revidiran

Jezik na kome želite da primite dokument.

Apstrakt

IEC 61190-1-3:2007 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an amendment to Table B.1 concerning lead-free solder alloys.

Životni ciklus

PRETHODNO

POVUČEN
IEC 61190-1-3:2002 ED1

TRENUTNO

POVUČEN
IEC 61190-1-3:2007 ED2
99.60 Povlačenje stupilo na snagu
13. 12. 2017.

ISPRAVKE / IZMENE

POVUČEN
IEC 61190-1-3:2007/AMD1:2010 ED2

REVIDIRAN OD

OBJAVLJEN
IEC 61190-1-3:2017 ED3