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IEC 60068-2-69:1995 ED1

Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method
8. 12. 1995.

Опште информације

99.60     9. 5. 2007.

IEC

TC 91

Međunarodni standard

19.040  

engleski   francuski   ruski   španski  

Kupovina

Revidiran

Jezik na kome želite da primite dokument.

Apstrakt

Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices.
The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.

Životni ciklus

TRENUTNO

POVUČEN
IEC 60068-2-69:1995 ED1
99.60 Povlačenje stupilo na snagu
9. 5. 2007.

ISPRAVKE / IZMENE

NAPUŠTEN
IEC 60068-2-69/AMD1 ED1

REVIDIRAN OD

POVUČEN
IEC 60068-2-69:2007 ED2