Projekti

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad

10.60   Završetak izjašnjavanja o predlogu

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad

10.60   Završetak izjašnjavanja o predlogu

Circuit Board 2D Barcode Marking Requirements

10.60   Završetak izjašnjavanja o predlogu

Thermal Endurance Test Method for Flexible Optic-Electric Circuit

00.99   Predlog novog projekta se prihvata

PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES– DESIGN AND USE - Part 8: 3D shape data for CAD component library

00.99   Predlog novog projekta se prihvata

Noncontact Temperature measurement for LAB using IR camera

00.00   Podnet predlog novog projekta

Electrical relay as interface for use in power applications (industrial and residential use)

10.60   Završetak izjašnjavanja o predlogu

Requirements and roadmap for DC protection function standardisation

00.00   Podnet predlog novog projekta

Insulation co-ordination for HVDC system — Part 1: Definitions, principles and rules

00.99   Predlog novog projekta se prihvata

Insulation co-ordination for HVDC system — Part 2: Application guidelines for line commutated converter (LCC) stations

00.99   Predlog novog projekta se prihvata

Electromagnetic compatibility (EMC) – Part 6-9: Generic standards – Emission standard for equipment in low Earth orbit

10.20   Početak izjašnjavanja o predlogu

Drafting of publications on electromagnetic field exposure assessment methods

30.99   Nacrt komisije standarda odobrava se za javnu raspravu

Information technology – Home Electronic System (HES) application model – GridWise Transactive Energy Framework

00.99   Predlog novog projekta se prihvata

Information technology – Generic cabling systems – Part 100: Classification of optical fibre channels

10.60   Završetak izjašnjavanja o predlogu

Internet of Things (IoT) – IoT application on power distribution system: Architecture and functional requirements

00.99   Predlog novog projekta se prihvata

Internet of Things (IoT) – Architecture considerations for IoT, edge and cloud

00.00   Podnet predlog novog projekta

(AWI) Internet of Things (IoT) – Guidelines on testing of IoT devices

00.00   Podnet predlog novog projekta

Internet of Things (IoT) - IoT system requirements for underground metallic structure corrosion monitoring

00.00   Podnet predlog novog projekta