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Glavni meni

IEC PAS 62173:2000 ED1

Solderability test method
22. 8. 2000.

Опште информације

99.60     15. 3. 2004.

IEC

TC 47

Javno dostupna specifikacija

31.080.01  

engleski  

Kupovina

Zamenjen

Jezik na kome želite da primite dokument.

Apstrakt

Provides a means of determining the solderability of device package terminations that are intended to be joined to another surface using solder for the attachment.
Provides also optional conditions for ageing and soldering for the purpose of allowing simulation of the soldering process to be used in the device application.

Životni ciklus

TRENUTNO

POVUČEN
IEC PAS 62173:2000 ED1
99.60 Povlačenje stupilo na snagu
15. 3. 2004.

REVIDIRAN OD

POVUČEN
IEC 60749-21:2004 ED1