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IEC 60749-21:2004 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
15. 3. 2004.

Опште информације

99.60     7. 4. 2011.

IEC

TC 47

Međunarodni standard

31.080.01  

engleski   francuski  

Kupovina

Revidiran

Jezik na kome želite da primite dokument.

Apstrakt

Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.

Životni ciklus

PRETHODNO

POVUČEN
IEC 60749:1996 ED2

POVUČEN
IEC 60749:1996/AMD1:2000 ED2

POVUČEN
IEC 60749:1996/AMD2:2001 ED2

POVUČEN
IEC PAS 62173:2000 ED1

TRENUTNO

POVUČEN
IEC 60749-21:2004 ED1
99.60 Povlačenje stupilo na snagu
7. 4. 2011.

REVIDIRAN OD

POVUČEN
IEC 60749-21:2011 ED2