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IEC PAS 62174:2000 ED1

Resistance to soldering temperature for through-hole mounted devices
22. 8. 2000.
95.99   Povučen   31. 3. 2003.

Опште информације

95.99     31. 3. 2003.

IEC

TC 47

Javno dostupna specifikacija

31.080.01  

engleski  

Kupovina

Zamenjen

Jezik na kome želite da primite dokument.

Apstrakt

Determines whether solid state devices can withstand the effects of the temperature to which they will be subjected during soldering of their leads. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.

Životni ciklus

TRENUTNO

POVUČEN
IEC PAS 62174:2000 ED1
95.99 Povučen
31. 3. 2003.

REVIDIRAN OD

POVUČEN
IEC 60749-15:2003 ED1