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IEC 60749-15:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
7. 2. 2003.

Опште информације

99.60     28. 10. 2010.

IEC

TC 47

Međunarodni standard

31.080.01  

engleski   francuski  

Kupovina

Revidiran

Jezik na kome želite da primite dokument.

Apstrakt

Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.

Životni ciklus

PRETHODNO

POVUČEN
IEC 60749:1996 ED2

POVUČEN
IEC 60749:1996/AMD1:2000 ED2

POVUČEN
IEC 60749:1996/AMD2:2001 ED2

POVUČEN
IEC PAS 62174:2000 ED1

TRENUTNO

POVUČEN
IEC 60749-15:2003 ED1
99.60 Povlačenje stupilo na snagu
28. 10. 2010.

REVIDIRAN OD

POVUČEN
IEC 60749-15:2010 ED2