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IEC 63287-3:2026 ED1

Semiconductor devices - Generic semiconductor qualification guidelines - Part 3: Guidelines for reliability qualification plans for power semiconductor module
6. 8. 2026.

Опште информације

60.60     6. 8. 2026.

IEC

TC 47

Međunarodni standard

31.080.01  

francuski   engleski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

IEC 63287-3:2026 specifies guidelines for a reliability qualification plan for power semiconductor modules to assure reliability targets over the entire product life.
Power semiconductor modules with incorporated control circuits are excluded. Clamped packages that need external pressure for being mounted in a system are excluded, e.g. disc-type pressure pack devices.
This document is not intended for medical, military, aeronautics and astronautics-related applications.
NOTE Throughout the document, the term power semiconductor module refers to multichip semiconductor power modules as defined in IEC 60191-4.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 63287-3:2026 ED1
60.60 Standard objavljen
6. 8. 2026.

Nacionalna preuzimanja

dnaSRPS EN IEC 63287-3:2024  
ISS

Poluprovodničke komponente – Opšte smernice za kvalifikaciju poluprovodnika – Deo 3: Smernice za planove kvalifikacije pouzdanosti energetskih poluprovodničkih modula

50.60   Završetak postupka odobravanja definitivnog teksta nacrta standarda

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