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IEC 60068-2-58:2004 ED3

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
15. 7. 2004.

Опште информације

99.60     27. 3. 2015.

IEC

TC 91

Međunarodni standard

19.040     31.190  

engleski   francuski   španski  

Kupovina

Revidiran

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Apstrakt

This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This standard provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys. This standard provides standard procedures for determining the solderability, dissolution of metallization and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders.

Životni ciklus

PRETHODNO

POVUČEN
IEC 60068-2-58:1999 ED2

TRENUTNO

POVUČEN
IEC 60068-2-58:2004 ED3
99.60 Povlačenje stupilo na snagu
27. 3. 2015.

REVIDIRAN OD

OBJAVLJEN
IEC 60068-2-58:2015 ED4