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IEC 60068-2-58:1999 ED2

Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
15. 1. 1999.

Опште информације

99.60     15. 7. 2004.

IEC

TC 91

Međunarodni standard

19.040     31.190  

engleski   španski  

Kupovina

Revidiran

Jezik na kome želite da primite dokument.

Apstrakt

Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices.

The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.

Životni ciklus

PRETHODNO

POVUČEN
IEC 60068-2-58:1989 ED1

TRENUTNO

POVUČEN
IEC 60068-2-58:1999 ED2
99.60 Povlačenje stupilo na snagu
15. 7. 2004.

REVIDIRAN OD

POVUČEN
IEC 60068-2-58:2004 ED3