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IEC 60749-20:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
30. 9. 2002.

Опште информације

99.60     9. 12. 2008.

IEC

TC 47

Međunarodni standard

31.080.01  

engleski   francuski   španski  

Kupovina

Revidiran

Jezik na kome želite da primite dokument.

Apstrakt

Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.

The contents of the corrigendum of August 2003 have been included in this copy.

Životni ciklus

PRETHODNO

POVUČEN
IEC 60749:1996 ED2

POVUČEN
IEC 60749:1996/AMD1:2000 ED2

POVUČEN
IEC 60749:1996/AMD2:2001 ED2

TRENUTNO

POVUČEN
IEC 60749-20:2002 ED1
99.60 Povlačenje stupilo na snagu
9. 12. 2008.

ISPRAVKE / IZMENE

POVUČEN
IEC 60749-20:2002/COR1:2003 ED1

REVIDIRAN OD

POVUČEN
IEC 60749-20:2008 ED2