IEC 60749-20:2008 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Datum objavljivanja: 9. 12. 2008.

Опште информације

Trenutna faza: 99.60 Effective date: 31. 8. 2020.

Sledeća faza: WPUB

Inicijator: IEC

Pripada: TC 47

Vrsta: Međunarodni standard

ICS: 31.080.01

Jezik: engleski francuski

Kupovina

Status: Revidiran

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Apstrakt

IEC 60749-20:2008 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This second edition cancels and replaces the first edition published in 2002 and constitutes a technical revision. The main changes are as follows:
- to reconcile certain classifications of IEC 60749-20 and those of IPC/JEDEC J-STD-020C;
- reference IEC 60749-35 instead of Annex A of IEC 60749-20, Edition 1;
- update for lead-free solder;
- correct certain errors in the original Edition 1.

Životni ciklus

PRETHODNO

POVUČEN
IEC 60749-20:2002 ED1

POVUČEN
IEC 60749-20:2002/COR1:2003 ED1

TRENUTNO

POVUČEN
IEC 60749-20:2008 ED2
99.60 Povlačenje stupilo na snagu
31. 8. 2020.

REVIDIRAN OD

OBJAVLJEN
IEC 60749-20:2020 ED3