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IEC 61188-5-8:2007 ED1

Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
30. 10. 2007.

Опште информације

60.60     30. 10. 2007.

IEC

TC 91

Međunarodni standard

31.180  

engleski   francuski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

IEC 61188-5-8:2007 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints.

This publication is to be read in conjunction with IEC 61188-5-1:2002.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 61188-5-8:2007 ED1
60.60 Standard objavljen
30. 10. 2007.

REVIDIRAN OD

OBJAVLJEN
IEC 61188-6-2:2021 ED1

OBJAVLJEN
IEC 61188-6-3:2024 ED1