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Glavni meni

IEC PAS 60191-6-18:2008 ED1

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
22. 1. 2008.

Опште информације

99.60     7. 1. 2010.

IEC

TC 47/SC 47D

Javno dostupna specifikacija

31.080.01  

engleski  

Kupovina

Zamenjen

Jezik na kome želite da primite dokument.

Apstrakt

This PAS provides common outline drawings and dimensions for all types of structures and composed materials of ball grid array (hereinafter called BGA), whose terminal pitch is one millimetre or larger and whose package body outline is square.

Životni ciklus

TRENUTNO

POVUČEN
IEC PAS 60191-6-18:2008 ED1
99.60 Povlačenje stupilo na snagu
7. 1. 2010.

ISPRAVKE / IZMENE

OBJAVLJEN
IEC 60191-6-18:2010/COR1:2010 ED1

OBJAVLJEN
IEC 60191-6-18:2010/COR2:2010 ED1

REVIDIRAN OD

OBJAVLJEN
IEC 60191-6-18:2010 ED1