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Glavni meni

IEC 60191-6-18:2010 ED1

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
7. 1. 2010.

Опште информације

60.60     7. 1. 2010.

IEC

TC 47/SC 47D

Međunarodni standard

31.080.01  

engleski   francuski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger. This standard cancels and replaces IEC/PAS 60191-6-18 published in 2008. This first edition constitutes a technical revision.

The contents of the corrigenda of May 2010 and July 2010 have been included in this copy.

Životni ciklus

PRETHODNO

POVUČEN
IEC PAS 60191-6-18:2008 ED1

TRENUTNO

OBJAVLJEN
IEC 60191-6-18:2010 ED1
60.60 Standard objavljen
7. 1. 2010.

ISPRAVKE / IZMENE

OBJAVLJEN
IEC 60191-6-18:2010/COR1:2010 ED1

OBJAVLJEN
IEC 60191-6-18:2010/COR2:2010 ED1