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Glavni meni

IEC 60191-6-19:2010 ED1

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
25. 2. 2010.

Опште информације

60.60     25. 2. 2010.

IEC

TC 47/SC 47D

Međunarodni standard

31.080.01  

engleski   francuski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.

Životni ciklus

PRETHODNO

POVUČEN
IEC PAS 60191-6-19:2008 ED1

TRENUTNO

OBJAVLJEN
IEC 60191-6-19:2010 ED1
60.60 Standard objavljen
25. 2. 2010.