IEC 60749-15:2010 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Datum objavljivanja: 28. 10. 2010.

Опште информације

Trenutna faza: 99.60 Effective date: 14. 7. 2020.

Sledeća faza: WPUB

Inicijator: IEC

Pripada: TC 47

Vrsta: Međunarodni standard

ICS: 31.080.01

Jezik: engleski francuski španski

Kupovina

Status: Revidiran

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Apstrakt

IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include:
- editorial change in the scope;
- addition of lead-free solder chemical composition specification.

Životni ciklus

PRETHODNO

POVUČEN
IEC 60749-15:2003 ED1

TRENUTNO

POVUČEN
IEC 60749-15:2010 ED2
99.60 Povlačenje stupilo na snagu
14. 7. 2020.

REVIDIRAN OD

OBJAVLJEN
IEC 60749-15:2020 ED3