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Glavni meni

IEC 61190-1-2:2014 ED3

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
19. 2. 2014.

Опште информације

60.60     19. 2. 2014.

IEC

TC 91

Međunarodni standard

31.190  

engleski   francuski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition:
a) modification of the solder powder size in Table 2;
b) addition of the information of "Reflow condition and profile" in Annex B;
c) addition of a new Annex C.

Životni ciklus

PRETHODNO

POVUČEN
IEC 61190-1-2:2007 ED2

TRENUTNO

OBJAVLJEN
IEC 61190-1-2:2014 ED3
60.60 Standard objavljen
19. 2. 2014.