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Glavni meni

IEC 61190-1-2:2007 ED2

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
26. 4. 2007.

Опште информације

99.60     19. 2. 2014.

IEC

TC 91

Međunarodni standard

31.190  

engleski   francuski  

Kupovina

Revidiran

Jezik na kome želite da primite dokument.

Apstrakt

IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.

Životni ciklus

PRETHODNO

POVUČEN
IEC 61190-1-2:2002 ED1

TRENUTNO

POVUČEN
IEC 61190-1-2:2007 ED2
99.60 Povlačenje stupilo na snagu
19. 2. 2014.

REVIDIRAN OD

OBJAVLJEN
IEC 61190-1-2:2014 ED3