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IEC 61190-1-2:2002 ED1

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
22. 3. 2002.

Опште информације

99.60     26. 4. 2007.

IEC

TC 91

Međunarodni standard

31.190  

engleski   francuski  

Kupovina

Revidiran

Jezik na kome želite da primite dokument.

Apstrakt

Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).

Životni ciklus

TRENUTNO

POVUČEN
IEC 61190-1-2:2002 ED1
99.60 Povlačenje stupilo na snagu
26. 4. 2007.

REVIDIRAN OD

POVUČEN
IEC 61190-1-2:2007 ED2