Termička standardizacija na kućištima poluprovodnika — Deo 6-2: Model termičke otpornosti i kapacitivnosti za predviđanje tranzijentne temperature na spoju i mernim tačkama — Metoda izrade modela korišćenjem mernih podataka poluprovodničke komponente
Thermal standardization on semiconductor packages - Part 6-2: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a measurement data of semiconductor device