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IEC 60749-20:2020 ED3

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
31. 8. 2020.

Опште информације

60.60     31. 8. 2020.

IEC

TC 47

Međunarodni standard

31.080.01  

engleski  

Kupovina

Objavljen

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Apstrakt

IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition:
- incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition );
- inclusion of new Clause 3;
- inclusion of explanatory notes.

Životni ciklus

PRETHODNO

POVUČEN
IEC 60749-20:2008 ED2

TRENUTNO

OBJAVLJEN
IEC 60749-20:2020 ED3
60.60 Standard objavljen
31. 8. 2020.

Nacionalna preuzimanja

SRPS EN IEC 60749-20:2020  
ISS

Poluprovodničke komponente - Metode mehaničkih i klimatskih ispitivanja - Deo 20: Otpornost plastičnih hermetički zatvorenih komponenti (SMDs, surface mount devices) na kombinovano dejstvo vlage i toplote lemljenja

60.60   Standard objavljen

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