Projekti

integrated circuits – Three Dimensional Integrated Circuits Part x: In-line thermal measurement of warpage

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Integrated circuits – Part X: Standardization Roadmap for Fan-Out Packages

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IEC60191-6-23 Ed.1.0 :Standardization roadmap for fan-out packages

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Thermal standardization on semiconductor packages - Part 2-3: 3D thermal simulation models of semiconductor packages for steady-state analysis - LQFP packages

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IEC 6xxxxx-2: Required Specifications of package substrates for advanced semiconductor packaging - Part 2 Failure Analysis Methods for Current Induced Quality Test of Package Substrates

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IEC 6xxxxx-3: Required Specifications of package substrates for advanced semiconductor packaging - Part 3 Standard Substrates structure for Current Induced Quality Test of Package Substrates

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Future IEC 63378-6-2 ED1: Thermal standardization on semiconductor packages - Part 6-2: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a measurement data of semiconductor device

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Test method of sound variation detection sensors for fire detection

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Semiconductor devices - Part 20: Machine-Interpretable Data Sheet for Power Semiconductors: Requirements for Data Format and Data Access for Power Electronic Design Tools

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Semiconductor Sensors - Semiconductor Magnetic Current Sensors for Basic and Reinforced Insulation

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Semiconductor devices - Part 14-XX: Semiconductor sensors - Performance test method for capacitive fingerprint sensors

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Semiconductor devices - Part 14-15: Semiconductor sensors - Performance test method of dynamic vision sensors

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Semiconductor devices - Micro-electromechanical devices - Part 64: Test methods of Terahertz sensing antenna-coupled MEMS bolometer

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Semiconductor devices - Micro-electromechanical devices - Part 65: Test methods for electrical stimulation environment and Electrophysiological measurement using 3D Cell-tissues Models with MEMS chips

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CONNECTORS FOR ELECTRONIC EQUIPMENT PRODUCT REQUIREMENTS Part 8-10X: Power connectors – Detail specification for 2-pole snap locking power rectangular connectors with plastic housing for rated current of 63 A

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Integration of automated driving and related electrified road infrastructure

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Inductors - Near Magnetic and Electric Field Characterization

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Ferrite cores - Guidelines on dimensions and the limits of surface irregularities - Part 17: Balun-cores

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