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Semiconductor devices - Micro-electromechanical devices - Part 42: Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever
60.60
Standard objavljen
Semiconductor devices - Micro-electromechanical devices - Part 43: Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices
60.60
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Semiconductor devices - Micro-electromechanical devices - Part 44: Test methods for dynamic performances of MEMS resonant electric-field-sensitive devices
60.60
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Semiconductor devices - Micro-electromechanical devices - Part 45: Silicon based MEMS fabrication technology - Measurement method of impact resistance of nanostructures
60.60
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Semiconductor devices - Micro-electromechanical devices - Part 46: Silicon based MEMS fabrication technology - Measurement method of tensile strength of nanoscale thickness membrane
60.60
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Semiconductor devices - Micro-electromechanical devices - Part 47: Silicon based MEMS fabrication technology - Measurement method of bending strength of microstructures
60.60
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Semiconductor devices - Micro-electromechanical devices - Part 48: Test method for determining solution concentration by optical absorption using MEMS fluidic device
60.60
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Semiconductor devices - Micro-electromechanical devices - Part 49: Temperature and humidity test methods for piezoelectric MEMS cantilevers
60.60
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Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
60.60
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Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
60.60
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Semiconductor devices - Micro-electromechanical devices - Part 50: MEMS capacitive microphones
60.60
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Semiconductor devices - Micro-electromechanical devices - Part 52: Biaxial tensile testing method for stretchable MEMS
60.60
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Semiconductor devices - Micro-electromechanical devices - Part 53: MEMS electrothermal transfer device
60.60
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Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
60.60
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Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
60.60
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Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
60.60
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Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
60.60
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Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
60.60
Standard objavljen
